HiCONNECTs
The EU-funded HiCONNECTs project aims to develop cloud and edge computing platforms that are sustainable, energy-efficient, and bring cloud services closer to end users.
(Funded by Key Digital Technologies Joint Undertaking (KDT JU))
Project-ID: 101097296
Duration: January 2023 - December 2025
Partners
15 countries involved, 64 beneficiaries
- Austria (3): AT&S, BESI-A, EVG
- Belgium (2): ICOS, IMEC
- Denmark (1): QTECHNOLOGY
- Finland (3): CENTRIA, SAVOX, SOFTABILITY
- France (4): NOVALIX, NXP-F, SEDA, 3DIS
- Germany (10): NXP-DE, AIXTRON, AMICRA, BARKHAUSEN, FBH, INNOLUME, SEMI-EU, DEEPXSCAN, FHG, HUBER
- Greece (2): ITML, HUA
- Hungary (1): SEMILAB
- Israel (12): APPLIED MATERIALS-IL, BRILLIANETOR, BRUKER, CORETIGO, KLA-IL, ORBOTECH, NANOMOTION, NOVA, NVIDIA-IL, PHONONIX, SKILLREAL, TERAMOUNT
- Italy (6): ACTIVE TECHNOLOGY, HORSA, POLITO, POLIMI, UNICT, ST-I
- Netherlands (8): BESI-NL, NFI, NXP-NL, PHIX, SOLMATES, THERMO, TNO, TU/e
- Romania (1): UPB
- Sweden (1): EXCILLUM
- Switzerland (3): CSEM, EVATEC, EXADDON
- Turkey (7): AVL-T, FORD-T, SMART, TUBITAK, TURKCELL, ULAK, SANLAB
HiCONNECTs is a consortium of 64 partners from 15 countries, develops the next generation of electronic components and systems heterogeneous integration core technology solutions for energy-efficient, high-performance wireless/wired cloud and edge computing and automotive radar in support of the next radio frequency and IT technology evolution.
HiCONNECTs aims to bring the computing and IT infrastructure in Europe to the next level by focusing on the development of heterogeneous integration of integrated circuits, discrete and photonics technologies into a system in a package, increasing technological reliability and efficiency.
As a basis for productization demonstrations like 5G, Radar (NXP) and networking systems (NVIDEA) developments, three pilot lines for heterogeneous integration of high frequency electronics and high bandwidth optics will be established:
1. InP based devices
2. SiPh devices
3. Advance packaging
Establishing these ambitious heterogeneous integration pilot lines, the part of HHI is to develop high performance InP PICs like direct modulated lasers (DML) and receivers for 3D heterogeneous chip-on-chip integration with high speed InP based RF electronics, developed by the project partner FBH for high speed 400 GBaud electro-optical transmission components.
Ambition
The HiCONNECTs project will enable both wired / wireless networks and edge / cloud data centers of the future to operate with high performance and reliability, increasing overall energy efficiency. Likewise, the project will enable enhanced sensing capabilities for radars by supporting parallel technology and packaging integration, allowing increased link budget and bandwidth while reducing the Bill of Material cost for the overall system.