Archive
100x100 Optics
Co-funded by: Future Fond Berlin and European Regional Development Fund
Duration: 07/2008 - 08/2011
3PEAT
3D Photonic integration platform based on multilayer PolyBoard and TriPleX technology for optical switching and remote sensing and ranging applications.
(Funded by: EU)
Duration: January 2018 – January 2022
ACTPHAST
Access CenTer for PHotonics innovAtion Solutions and Technology Support
Duration: November 2013 – October 2017
AUTOHYB
Automated hybrid photonic integration for sensing and quantum technologies
(Fraunhofer SME Project)
Duration: July 2021 – June 2024
TERAWAY
Terahertz technology for ultra-broadband and ultra-wideband operation of backhaul
and fronthaul links in systems with SDN management of network and radio resources
(Funded by the European Union)
Duration: November 2019 – August 2023
TERAmeasure
Non-contact millimeter and Terahertz frequency measurement paradigm for instrumentation and sensing applications unlocking metrology-grade results
(Funded by the European Union)
Duration: November 2019 – October 2023
PhLEXSAT
Photo-Digital Channelizer for Flexible Digital High Throughput Satellites
(Funded by the European Union)
Duration: November 2020 - April 2023
TERIPHIC
Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond
(Funded by the European Union)
Duration: January 2019 – September 2022
InPulse
Indium-Phosphide Pilot Line for up-scaled, low-barrier, self-sustained, PIC ecosystem
This project is funded by the European Union's Horizon 2020 research and innovation programme.
Duration: January 2019 - December 2022
optION
Optical Microring Sensor for quantitative Analysis of Electrolytes
(Funded by the German Federal Ministry of Education and Research)
Duration: Februar 2019 – Oktober 2022
ProtoPIC
Platform for KMU-access for rapid prototype development of photonic integrated circuits
(Fraunhofer SME Project)
Duration: January 2020 - December 2022
LZDV IV
(Fraunhofer Project)
Duration: January 2022 - December 2022
HIGHLAND
(Fraunhofer Project)
Duration: June 2020 – April 2022
T-KOS
Terahertz Technologies for Communication and Sensor Technology
Duration: May 2021 – August 2022
UNIQORN
Affordable Quantum Communication for Everyone: Revolutionizing the Quantum Ecosystem from Fabrication to Application
Duration: October 2018 - July 2022
PIXAPP
PIXAPP provides the full range of assembly and integration technologies needed to package multifunctional PIC (Photonic Integrated Circuit) devices, across all stages of manufacturing - from prototyping to medium scale manufacture.
CiViQ
Applying CV-QKD in Existing Telecom Infrastructure
Duration: October 2019 – September 2022
QAMeleon
EU Project QAMeleon to develop the next generation of photonics and electronics technology that will enable 128 Gbaud optical data flow generation, reception and switching over an SDN platform.
(Funded by: EU)
Duration: January 2018 - December 2021
PolyPhotonics Berlin
Optical components made of polymer
(Funded by: Federal Ministry of Education and Research)
Duration: September 2016 – August 2020
PHONOGRAPH
Graphene-based photonic integration technologies for wireless terabit communication systems
Duration: September 2016 – August 2020
HIPPIOS
ProFIT-Projekt “High-Port Photodiode Integrated Optical Spectrometer”
Project Financing: European Regional Development Fund (ERDF) and Investitionsbank Berlin (IBB)
Duration: January 2018 - December 2019
Phoenix+
Photonics & Optoelectronics Network
Project Financing: Programme for Internationalisation (PfI) - Promotion of Network Building
Duration: November 2016 - October 2019
HAMLET
Heterogeneous Advancement and hybrid integration of polyMer and tripLEx platform for integrated microwave phoTonics
Duration: December 2015 – May 2019
SPEED
Silicon Photonics Enabling Exascale Data Networks
Duration: November 2015 – November 2018
PANTHER
PAssive and electro-optic polymer photonics and InP electronics iNtegration for multi-flow Terabit transceivers at edge SDN switcHes and data-centER gateways
Duration: January 2014 – December 2016
SPIRIT
SPIRIT focus is the development of a programmable optical transceiver for next-generation flexible optical networks which includes multi-level modulators, flexible wavelength MUX/DEMUXs and high-speed receivers.
Duration: 2013 – 2016
ADVAntagePON
Co-funded by: Federal Ministry of Education and Research (BMBF)
Duration: 07/2011 - 06/2014
ASTRON (Adaptive Software defined Terabit Transceiver for flexible Optical Networks)
Co-funded by: Framework 6 of European Commission Development Fund
Duration: 10/2012 - 09/2015
Berlin-Access
Test bed and technologies for broadband optical subscriber lines. Part B: Components
Co-funded by: Future Fond Berlin and European Regional Development Fund (TSB)
Duration: 07/2005 - 05/2008
EuroPIC (European manufacturing platform for Photonic Integrated Circuits)
Co-funded by: Framework 7 of European Commission Development Fund
Duration: 09/2009 - 08/2012
HiLight
July 2011 – June 2014
HiLight – Hochlinearer Optischer Empfänger für digitale 400 Gb/s Systeme
Funded by Federal Ministry of Education and Research
In Cooperation with u2t Photonics AG, IHP GmbH
HINT
October 2010 – March 2013
HINT – Hochauflösende Infrarot-Niedertemperatur-Thermometrie auf der Basis von III/V Halbleitersensoren
Funded by Federal Ministry of Education and Research
In Cooperation with Optris GmbH, Micro-Sensors GmbH
MiniWDM
Miniaturized optical polymer chips for wavelength division multiplex (WDM) transmission in future optical broadband communication systems
Co-funded by: Federal Ministry for Economic Affairs and Energy (BMWi)
Duration: 01/2008 - 12/2010
MIRTHE
MIRTHE targets new multilevel-modulation all-monolithic integrated TX and RX Photonic Integrated Circuits (PICs) able to achieve 100-400 Gb/s aggregated speed on a single wavelength.
NAPOLY (New applications of polymers for passive optical components)
Co-funded by: ALCATEL SEL AG, ZFZ/OC, Stuttgart, Germany
Duration: 03/1998 - 12/2003
PARADIGM (Photonic Advanced Research And Development for Integrated Generic Manufacturing)
Co-funded by: Framework 7 of European Commission Development Fund
Duration: 10/2010 - 08/2014
PICASSO
Photonic Integrated Components Applied to Secure chaoS encoded Optical communications systems
PolyBoard
Co-funded by: Federal Ministry of Education and Research (BMBF)
Duration: 12/2011 - 11/2013
PolyMUX
Co-funded by: Federal Ministry of Education and Research (BMBF)
Duration: 07/2001 - 06/2004
POLYPLANAR (Modular system components based on planar optical polymer chips)
Co-funded by: Bundesministerium für Bildung und Forschung (BMBF)
Duration: 05/2008 - 01/2011
POWER (Polymer optical waveguide enhanced router)
Co-funded by: PIRELLI Cavi SPA, Milan, ItalyDuration: 02/1998 - 01/2000
10Gb/s TOSA with extended temperature range
Co-funded by: Federal Ministry for Economic Affairs and Energy (BMWi)
Duration: 07/2007 - 12/2008
Topic: 1490nm and 1550nm transmitter module for 10Gb/s operation
OTUS-ESA
Co-funded by: Framework 6 of European Commission Regional Development Fund
Duration: 11/2006 - 11/2008
Topic: design, manufacturing and test of a representative end-to-end breadboard of an ultra-fast and high-throughput optical switch
APACHE (Agile Photonic Integrated Systems-on-Chip enabling WDM Terabit Networks)
Co-funded by: Framework 7 of European Commission Development Fund
Topic: The APACHE project aims to design and develop new generation of transmitter, receiver and regenerator photonic circuits capable to handle 100 Gb/s data rates and a multiplicity of modulation formats that will enhance the transmission efficiency of optical fiber. APACHE exploits hybrid integration technology for delivering Terabit capacity on a single photonic integrated circuit.
On the physical layer APACHE aims at extending photonic circuit integration capabilities. Its integration concept relies on the combination of Indium-Phosphide monolithic elements, silicon submounts and silica-on-silicon planar lightwave circuits.
BOOM
Micro and nano-scale silicon photonic integrated components and sub-systems enabling Tb/s-capacity, scalable and fully integrated photonic routers
Co-funded by: Framework 7 of European Commission Development Fund
Topic: BOOM is an integration project that aims to pursue the systematic davancement of Silicon-on-Insulator (SOI) integration technology to develop compact, cost-effective and power efficient silicon photonic components that enable photonic Tb/s capacity systems for current and new generation high speed broadband core networks.
COMAN (Components for Optical Monitoring in Access Networks)
Co-funded by: Federal Ministry of Education and Research (BMBF)
Duration: 02/2007 - 01/2009
Topic: optical transceiver with integrated monitoring functions
CONDOR (Converged Heterogeneous Metro/Access Infrastructure)
Co-funded by: Federal Ministry of Education and Research (BMBF)
Duration: 04/2010 - 03/2013
Cooperation: Alcatel-Lucent, UKA-IPQ, UKA-ITIV, JDSU, Leoni, FhG-HHI
Topic:
- widely tunable 10G hybrid lasers comprising of an InP gain chip and a polymer grating
- high speed lasers for OFDM applications
EIBONE
Co-funded by: Federal Ministry of Education and Research (BMBF)
Duration: 09/2005 - 08/2008
Cooperation: Fraunhofer-HHI (InP chips), TU-Berlin (SOI board technology) und u2t Photonics AG (module technology)
Topic: Design and fabrication of flip-chip mountable balanced photodiodes and SOA-Chips, to be placed on an SOI-based D(Q)PSK network board, to achieve a 50 Gbit/s D(Q)PSK-Photoreceiver
GIBON
Co-funded by: Framework 6 of European Commission Development Fund
Topic: The focus of GIBON is on the demonstration of the highest speed components that integrate the optoelectronic transducers (light modulator and photodiode) with their driving electronics (driver and preamplifier respectively). New transmitters and receivers will be developed based on designs experienced at lower bit rates (40 and 80 Gbit/s) and their characteristics will be optimised in order to match specifications that will be derived from systems considerations. In order to reach the 100 Gbit/s objective, the integration technology that will be used for the transceivers is as important as the optoelectronic devices characteristics. Guidelines for the design and realization of integrated devices as well as for the components packaging will be given by a supporting Electro-Magnetic simulation activity. This project will be completed by an assessment of the fabricated components with respect to the projected.
HECTO
Co-funded by: Framework 6 of European Commission Development Fund
Topic: The objective of HECTO is development of photonic components, transmitter and receiver, for high-performance and high-speed but cost-efficient communication systems. Applications are Time Division Multiplexed (TDM) optical systems with up to 160Gbit/s as well as optical packet-switching networks based on serial 100GbE signals requiring about 110Gbit/s. Especially, receivers with bandwidths of 100GHz and above will be developed with waveguide pin photodetectors integrated with electronic amplifiers, and the required high-speed electronics for electrical clock recovery and demultiplexing to lower speeds. The components will be tested in systems experiments. To ensure that they will meet the demands of the future market, technology application assessment will accompany the technical investigation and development.
SFB 787
www.sfb787.tu-berlin.de/menue/home/
Co-funded by: German Research Council (DFG)
Duration: 01/2008 - 12/2011
Mephisto (Merger of Electronics and Photonics Using Silicon Based Technologies)
Co-funded by: Framework 6 of European Commission Development Fund
Duration: 08/2004 - 10/2008
Topic: integrated wavelength division multiplexing transmitter component
OptiDot
Al-free quantum dot laser structures: technology and optical properties
Co-funded by: IBB Berlin/PROFIT program and European Regional Development Fund
Duration: 01/2006 - 12/2007
Cooperation: TU Berlin
Topic: Optical quantum dot materials based on InP