Photonic Components

The Photonic Component Department (PC) researches optochips and Photonic Integrated Circuits (PICs) for 100+ Gbit/sec data transmission and detection and sensor applications. The scientists offer production and development services in all of their activities to the German and international industry. As an example, if you already have a concrete optochip design in mind, the researchers offer additional consulting and would do design and fabrication iterations. Or if you start with a target spec, they would typically begin with a feasibility study and generate a design of their own. In all cases, they are able and willing to do initial production volumes in ISO certified, qualified production. Furthermore they offer e-beam services, and design-to-spec diffractive optical elements.

The 1.2-1.9 µm wavelength range is very interesting for sensing applications. Here, telecom technology based lasers and detectors are in the portfolio serving applications from industrial combustion sensing to satellite-to-satellite optical communication. The scientists also research silicon wafer based sensor applications.

Terahertz waves carry with them a multitude of potential applications e.g. in non destructive testing. Key advantage is the ability to cope with foam-like substances and to work without physical contact. This is important for modern, light weight materials and for in line process control e.g. in extruders at ~200°C. Fraunhofer HHI uses telecom technology to bring terahertz sensing from the lab table to a handheld technology.