December 17, 2024
The 'Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems' (APECS) pilot line has officially launched with funding of 730 million euros. Initiated by the Research Fab Microelectronics Germany (FMD) with the Fraunhofer Heinrich-Hertz-Institut (HHI) and other partners, the APECS initiative aims to strengthen Europe's technological resilience and boost global competitiveness in the semiconductor industry. This launch represents a key milestone in the successful implementation of the EU Chips Act.
The pilot line is focused on driving innovation in chiplet technology and significantly expanding research and production capacities for semiconductors across Europe. Supported by the EU Chips Joint Undertaking and national funding programs under the “Chips for Europe” initiative, APECS will operate for 4.5 years with total funding of 730 million euros.
As part of the EU Chips Act, the European Commission is making significant investments to advance semiconductor technologies and applications within the EU. The goal is to boost technological resilience, secure supply chains, and accelerate innovation in key sectors such as artificial intelligence, mobility, manufacturing, information and communication technologies, sustainable electronics, and neuromorphic and quantum computing. The APECS pilot line focuses on the scalable transfer of newly developed heterogeneous integration innovations, bridging the gap to application-oriented research. It goes beyond conventional "system-in-package" (SiP) methods, aiming to deliver robust and trustworthy heterogeneous systems.
“Fraunhofer plays a central role in implementing large-scale projects like APECS, which strengthen Germany's innovative power and technological resilience,” says Prof. Holger Hanselka, President of Fraunhofer-Gesellschaft. “Through practical research and close collaboration with industry, academia, and political partners, we lay the foundation for developing cutting-edge technologies and bringing them into industrial application. The APECS pilot line exemplifies how bridging research and industry can secure Europe's long-term position in the global microelectronics market.”
APECS also aims to unlock new functionalities through system technology co-optimization (STCO) and to standardize integration technologies. This will enable companies to develop advanced products in small quantities at competitive costs. With its comprehensive range of technologies, APECS will become Europe's leading hub for advanced packaging and heterogeneous integration. By promoting eco-design and sustainable manufacturing practices, the initiative will play a vital role in Europe's transition to a climate-neutral and circular economy.
As a driving force for collaboration among European research institutions, industry and academia, the APECS pilot line fosters a vibrant innovation ecosystem. It provides a comprehensive platform, integrating end-to-end design and pilot production capacities, enabling the advancement of innovations from cutting-edge research to scalable manufacturing processes.
Investing in strategic projects like APECS is essential for positioning Europe at the forefront of the global technology industry. Germany, as a leading research hub and economic powerhouse, plays a key role in this endeavor. This critical step toward securing long-term economic stability for both Germany and Europe has been made possible through substantial funding from EU programs such as Horizon Europe and “Digital Europe” (DIGITAL), as well as the Federal Ministry of Education and Research (BMBF) and the federal states of Saxony, Berlin, Bavaria, Schleswig-Holstein, Baden-Württemberg, North Rhine-Westphalia, Brandenburg and Saxony-Anhalt.
The APECS pilot line is based on the structures of the Research Fab Microelectronics Germany (FMD). Eleven other institutes from the Fraunhofer Group for Microelectronics, along with the Leibniz Institutes FBH and IHP, are involved in APECS alongside Fraunhofer HHI. The initiative also includes a strong European consortium, pooling technological expertise, infrastructure and know-how from ten partners across eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator, FBH, IHP), Austria (TU Graz), Finland (VTT), Belgium (imec), France (CEA-Leti), Greece (FORTH), Spain (IMB-CNM, CSIC) and Portugal (INL). The APECS pilot line is coordinated by Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD).