Current projects
PARALIA
Photonic Multi-beam Beamforming Technology enabling RADAR/LiDAR Multi-sensor Fusion platforms for Aerospace and Automated Driving applications
(Funded by: EU)
Duration: January 2023 - June 2026
Space FIT
Research on compact QKD receiver payloads for high-altitude platforms and satellites
(Funded by the state of Berlin - Co-funded by the European Union (EU))
Duration: October 2024 - September 2027
QuNET+DECODE
optimizeD cohErent reCeiver fOr cv-qkD systEms
Program Indentification Code: QuNet+
(Funded by the Federal Ministry of Education and Research)
Duration: December 2022 – November 2025
QuNET+RECONNAITRE
Complexity-Optimised Quantum Receiver with Free Beam Interface
(Funded by the German Federal Ministry of Education and Research)
Network Coordinator: Pixel Photonics GmbH
Duration: January 2022 - December 2024
HiCONNECTs
The EU-funded HiCONNECTs project aims to develop cloud and edge computing platforms that are sustainable, energy-efficient, and bring cloud services closer to end users.
Duration: January 2023 – December 2025
CiViQ
Continuous Variable Quantum Communications
Applying CV-QKD in Existing Telecom Infrastructure
TERIPHIC
Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond
QAMeleon
EU Project QAMeleon to develop the next generation of photonics and electronics technology that will enable 128 Gbaud optical data flow generation, reception and switching over an SDN platform.
Past projects
HiLight
July 2011 – June 2014
HiLight – Hochlinearer Optischer Empfänger für digitale 400 Gb/s Systeme
Funded by Federal Ministry of Education and Research
In Cooperation with u2t Photonics AG, IHP GmbH
HINT
October 2010 – March 2013
HINT – Hochauflösende Infrarot-Niedertemperatur-Thermometrie auf der Basis von III/V Halbleitersensoren
Funded by Federal Ministry of Education and Research
In Cooperation with Optris GmbH, Micro-Sensors GmbH
MIRTHE
MIRTHE targets new multilevel-modulation all-monolithic integrated TX and RX Photonic Integrated Circuits (PICs) able to achieve 100-400 Gb/s aggregated speed on a single wavelength.
EIBONE
Co-funded by: Federal Ministry of Education and Research (BMBF)
Duration: 09/2005 - 08/2008
Cooperation: Fraunhofer-HHI (InP chips), TU-Berlin (SOI board technology) und u2t Photonics AG (module technology)
Topic: Design and fabrication of flip-chip mountable balanced photodiodes and SOA-Chips, to be placed on an SOI-based D(Q)PSK network board, to achieve a 50 Gbit/s D(Q)PSK-Photoreceiver
GIBON
Co-funded by: Framework 6 of European Commission Development Fund
Topic: The focus of GIBON is on the demonstration of the highest speed components that integrate the optoelectronic transducers (light modulator and photodiode) with their driving electronics (driver and preamplifier respectively). New transmitters and receivers will be developed based on designs experienced at lower bit rates (40 and 80 Gbit/s) and their characteristics will be optimised in order to match specifications that will be derived from systems considerations. In order to reach the 100 Gbit/s objective, the integration technology that will be used for the transceivers is as important as the optoelectronic devices characteristics. Guidelines for the design and realization of integrated devices as well as for the components packaging will be given by a supporting Electro-Magnetic simulation activity. This project will be completed by an assessment of the fabricated components with respect to the projected.
HECTO
Co-funded by: Framework 6 of European Commission Development Fund
Topic: The objective of HECTO is development of photonic components, transmitter and receiver, for high-performance and high-speed but cost-efficient communication systems. Applications are Time Division Multiplexed (TDM) optical systems with up to 160Gbit/s as well as optical packet-switching networks based on serial 100GbE signals requiring about 110Gbit/s. Especially, receivers with bandwidths of 100GHz and above will be developed with waveguide pin photodetectors integrated with electronic amplifiers, and the required high-speed electronics for electrical clock recovery and demultiplexing to lower speeds. The components will be tested in systems experiments. To ensure that they will meet the demands of the future market, technology application assessment will accompany the technical investigation and development