Laser World of Photonics 2023

JUN 2023

27 - 30

Munich, Germany

The Fraunhofer Heinrich-Hertz-Institut HHI is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions.

At Laser World of Photonics 2023 Fraunhofer HHI presents the latest developments in Photonic Components in hall A2 at booth 421 from June 27-30 in Munich, Germany.

Contact

Jörn Falk

Jörn Falk

Head of General Administration

Phone +49 30 31002-275

Hybrid PICs for Quantum Technologies

Fraunhofer HHI‘s micro optical bench with nonlinear crystal for SHG and OPDC (top)

Polymer-based BB84 transmitter for DV QKD (bottom)


Photonic integration in the hybrid integration platforms of Fraunhofer HHI enables the realization of miniaturized complex photonic integrated circuits (PICs) for quantum technologies. The broad spectral transparency allows for the integration of nonlinear optical crystals, generating photon pairs via spontaneous parametric down conversion. The hybrid integration of active optoelectronic components with highly efficient passive optical functionalities, such as spectral and polarization filters as well as optical isolators, facilitates the on-chip qubit preparation and read-out. Among others, this approach enabled the development of a BB84 transmitter PIC in the BMBF QuNET project.

Technical Contact

Crispin Zawadzki

Crispin Zawadzki

Deputy Head of Hybrid PICs Group

Phone +49 30 31002-624

Silicon Nitride PICs for Sensing

SiN-based PIC with 8 micro ring resonators as disposable for diagnostics and life science

The silicon nitride platform of Fraunhofer HHI enables highly integrated photonic sensor chips in the field of diagnostics and life science, environmental analysis, as well as food analytics. Real-time capable disposable sensors with multiple sensing channels, each sensitized to detect proteins, small molecules, vitamins, viruses, bacteria or nucleic acids, are possible.

All chips are compatible with our simple, adjustment free fiber connecting scheme.

Technical Contact

Crispin Zawadzki

Crispin Zawadzki

Deputy Head of Hybrid PICs Group

Phone +49 30 31002-624

RF PIC Evaluation with RFconnect

A compact assembly for convenient and cost-effective evaluation up to 40 GHz

RFconnect, Fraunhofer HHI’s new fiber coupled RF PIC assembly, states a compatible expansion of the already established and successful DC multisource PIConnect. The thermally controllable assembly with 8 RF & optical ports as well as 42 DC ports facilitates the connection of RF measurement equipment.

Technical Contact

M. Sc. Axel Schönau

M. Sc. Axel Schönau

Deputy Head InP Foundry Group

Phone +49 30 31002-494

Fiber-Coupled Terahertz Modules

Record emitted terahertz power of 970 µW

We present the newest generation of fiber-coupled terahertz modules for application in spectroscopy and non-destructive testing.

Our newly developed semiconductor layers make it possible to raise the terahertz output power to 970 µW, thus increasing the dynamic range of pulsed terahertz systems. This leads, for example, to a significant improvement in the reliability of thickness determination of very thin layers.

Technical Contact

Dr. rer. nat. Robert Kohlhaas

Dr. rer. nat. Robert Kohlhaas

Head of Terahertz Sensors and Systems Group

Phone +49 30 31002 407

Test and Measurement for 6G and Beyond

Broadband spectral coverage from 100 GHz to 4.5 THz

The photonic continuous-wave terahertz systems developed by Fraunhofer HHI are well suited for test and measurement applications for 6G and beyond. In contrast to electronic mixer circuits, with a single system the photonic approach allows for broadband access to frequencies between 100 GHz and 4.5 THz. Since the specific frequency bands of future wireless communication channels are still a topic of debate, our approach helps to reduce this uncertainty by providing access to a broad spectral range.

Technical Contact

Dr. rer. nat. Robert Kohlhaas

Dr. rer. nat. Robert Kohlhaas

Head of Terahertz Sensors and Systems Group

Phone +49 30 31002 407

Photodetectors for Sensing Applications

InGaAs based SWIR Photodetectors

We provide InGaAs-based photodiodes with high sensitivity at NIR and SWIR wavelengths. Quantum efficiencies are up to 99%, and dark current density is 10 nA/cm² at room temperature. In order to cover the complete SWIR range up to 2500 nm, extended InGaAs based photodiodes are available as well. Customized segmented or array devices can be provided on demand. Besides pin photodiodes, avalanche and single photon diodes are available as well.

Technical Contact

Dr.-Ing. Patrick Runge

Dr.-Ing. Patrick Runge

Head of InP and RF Department
Head of Modulators and Detectors Group

Phone +49 30 31002-498

High-Power Laser Diodes

Highest optical Output Power from a single Emitter

Fraunhofer HHI's newest generation of high-power Laser diodes provide up to 4.9 Watt in cw-operation around 1550 nm from a single 100µm emitter. The devices can be used in a wide range of applications in industry, medical and defense.

Technical Contact

Niklas Kanold

Research Associate

Phone +49 30 31002-525

Current developments from the Fraunhofer Cluster of Excellence Advanced Photon Sources CAPS – Booth A3.441

Fraunhofer CAPS promotes the cooperative development and processing of a new generation of laser systems through a cross-institute research structure by increasing the output power of ultrashort pulse lasers (UKP) by an order of magnitude and investigating their potential applications. 

The focus is on three research fields whose current development status will be presented at LASER by the participating institutes Fraunhofer ILT, Fraunhofer IOF, Fraunhofer IZI-BB, Fraunhofer HHI, Fraunhofer IFAM, Fraunhofer IKTS, Fraunhofer ISIT Fraunhofer IWS and Fraunhofer IAF:

Laser beam sources
Including gas multipass cell for post-compression of ultrashort femtosecond lasers; high-resolution nanoscope with an EUV laser source.

Systems engineering
Multi-beam demonstrator

Laser application
Including large electrolyzer structured by ultrafast laser for the conversion of electrical energy into hydrogen; ultrafast laser drilling for e.g. aerosol generators; flexible glass lenses for thermal imaging cameras

Technical Contact

apl. Prof. Dr. Eike G. Hübner

apl. Prof. Dr. Eike G. Hübner

Phone +49 5321 3816-8409

Catch our talks at Laser World of Photonics 2023

Jakob Reck (Fraunhofer HHI)
Lab in a Shoebox – Photonic Integrated Circuits for Biomedical Sensing (Photonics for MedTec)
June 27, 2023 from 4:10 PM to 4:22 PM, hall B2 | booth 248

Prof. Martin Schell (Fraunhofer HHI)
Co-chair of Application Panel: Integrated Photonics
June 29, 2023 from 10:00 AM to 12:00 PM, hall A2 | booth 249

Dr. Moritz Kleinert (Fraunhofer HHI)
Hybridly Assembled PICs for Communications, Sensing and Quantum Technologies
June 29, 2023 from 11:45 AM to 12:00 PM, hall A2 | booth 249