Fraunhofer HHI presents sensory optical seals for real-time tamper protection of security-relevant hardware components like cryptographic communication chips. The optical seals, made of sensory ultra-thin glass slides, enclose the object to be protected. Autonomic alarm management is coupled with permanent monitoring of the integrity or change of state of seal.

An InP technology to cover a vast variety of monolithic or hybrid integration solutions

The generic InP integration platform at Fraunhofer HHI continues to be extended. Latest upgrades include components for handling of optical polarization as well as general performance upgrades. Fraunhofer HHI offers an InP platform that integrates receivers (40GHz), transmitters (20GHz) and (1dB/cm) passive components. Partners offer services for design work and packaging.

Polymer PICs now at 785nm and 1064nm

The PolyBoard platform of Fraunhofer HHI enables the hybrid integration of active and passive optical functionalities into complex and highly functional photonic integrated circuits (PICs). Recent developments include tunable lasers at wavelengths of 785 nm and 1064 nmfor applications in sensing and spectroscopy. Furthermore, PolyBoard’s micro-optical bench allows for the on-chip integration of optical isolators and circulators as an addition to the tunable lasers, as well as nonlinear crystals for quantum technologies.

Real-time layer thickness measurements

Terahertz radiation is increasingly employed for industrial process monitoring and material inspection. Coating layer thickness, the structure of polymers or imperfections in non-conductive materials can be determined.

Fraunhofer HHI presents a live demonstration of our continuous-wave system T-Sweeper. The measurement rate of up to 60 points per second allows for thickness measurements in real time, which makes the T-Sweeper a cost-efficient and robust alternative to pulsed THz systems.

Components for 1Tb/s Transmission and Microwave Photonics

Fraunhofer HHI provides single and balanced photodetector modules with a bandwidth up to 145 GHz operating from the O- to the L-band. The intended application for the modules is test and measurement. For the application of microwave photonics dedicated high-power photodetector modules are presented.

Hauke Conradi et al.: Hybrid integration of a polarization independent optical circulator and a latching switch. (Regular Paper)
February 4, 2020 - 10:10-10:30 am | Integrated Optics: Devices, Materials, and Technologies XXIV | Session 4: Photonic Integration Technologies.

Lars Liebermeister et al.: Continuous-wave terahertz spectrometer without active phase modulation. (Regular Paper)
February 4, 2020 - 3:30-3:50 pm, Room 307, Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XIII, Session 8.

Panos Groumas et al.: Enabling low-cost, high-volume production compatible Terabit transceivers with up to 1.6 Tbps capacity and 100 Gbps per lane PAM-4 modulation for intra-data center optical interconnects up to 2 km: The TERIPHIC project approach. (Invited Paper)
February 5, 2020 - 4:50-5:20 pm | Metro and Data Center Optical Networks and Short-Reach Links III | Session 4: Transponders and Modules for Datacom.

Björn Globisch et al.: Next-generation photo-conductive THz devices for 1550nm excitation. (Regular Paper)
February 5, 2020 - 9:00-9:20 am, Room 307, Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XIII, Session 10.

David de Felipe et al.: Polymer-based tunable lasers for a wide range of applications: from telecom to sensing and spectroscopy. (Invited Paper)
February 6, 2020 - 11:20-11:50 am | Physics and Simulation of Optoelectronic Devices XXVIII | Session 13: Integrated Ultra Lasers.