OFC 2020
MAR 2020
10 - 12
San Diego, USA
The Fraunhofer Heinrich Hertz Institute HHI is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals. Together with international partners from research and industry, Fraunhofer HHI works in the whole spectrum of digital infrastructure – from fundamental research to the development of prototypes and solutions.
At OFC 2020 Fraunhofer HHI presents the latest developments in Photonic Components, Networks and Systems at Fraunhofer Booth 4513 from March 10-12 in San Diego, USA.
Hybrid PICs
Best of all worlds
Fraunhofer HHI’s innovative technology platform PolyBoard enables the hybrid integration of complex photonic components based on InP, polymer, graphene, and SiN materials as well as micro-optical elements (TFF, PBS, Faraday rotator). Recent developments include tuneable lasers at 785 nm and 1064 nm and optical isolators and circulators in the C-band.
High-Speed Photodetector Modules
Components for 1Tb/s Transmission and Microwave Photonics
Fraunhofer HHI provides single and balanced photodetector modules with a bandwidth up to 145 GHz operating from the O- to the L-band. The intended application for the modules is test and measurement. For the application of microwave photonics dedicated high-power photodetector modules are presented.
LiFi – Light Communication
Make your light smarter
For the first time, Fraunhofer HHI presents a mobile device enabling Gigabit LiFi for wireless Internet access via light. The new devices feature a universal interface offering both, powering and Gigabit data transfer via USB. Usability is enhanced through data rates up to 1 Gbit/s, small form factor, low energy consumption and multiuser access. The new modules are now available for industrial prototyping and field tests.
100G Coherent Receiver Frontend
High speed, 200 GHz optical bandwidth, optical extender heads
It is crucial to develop ultra-high speed optical instruments to meet continuously growing demand for bandwidth for telecom and datacom applications. The Fraunhofer HHI researchers developed a 100 GHz Coherent Receiver Frontend (CRF-100G), offering 200 GHz optical bandwidth detection with polarization- and phase-diversity over C+L-band. Its unique feature of customizable optical extender heads with an RF connection of 1mm enables to maintain high signal integrity, resulting in robust testing and measurement performance for cutting-edge research and development activities. In addition, the ruggedized solution, available on request, provides convenient handling and operation for customers of Fraunhofer HHI.
Digital Signal Processing Library
Ready-to-use DSP-Library for optical system simulations and experiments
The DSP-Library for coherent optical systems is available as pluggable toolkit for VPItransmissionMaker™ Optical Systems and VPIlabExpert™. It provides an extensive collection of lab-proven DSP algorithms designed to speed up your development and testing of optical system applications and components.
Performance Leading 40GHz Bandwidth DP-IQ Reference Transmitter
Fully integrated optical frontend that converts differential electrical RF signals into IQ-modulated optical signals.
The new Optical Multi-Format Transmitter (OMFT) is a fully integrated optical frontend instrument that converts differential electrical RF signals into various optical modulation formats (e.g. QPSK and m-QAM) by the use of a High-bandwidth dual-polarization IQ Mach Zehnder based optical modulator and an optional high fidelity tunable laser source. It is an ideal match to convert signals generated by an electrical Arbitrary Waveform Generator (AWG) source into the optical domain.
PIC Platforms at Fraunhofer HHI
Hybrid PIC solutions for performance without compromise
Fraunhofer HHI offers PIC technologies ranging from purely passive polymer chips over active InP all the way to sophisticated hybrid solutions that combine the best of the two. InP offers optical gain and excellent E/O components, while the PolyBoard technology offers integration of arbitrary thin film elements or optical isolators.